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PPGA Last modified: Wednesday, January 15, 2003

Short for Plastic Pin Grid Array. PPGAs were first developed by Intel in 1993 to combat power supply decoupling issues in high-performance microprocessors.This square chip packaging technology was designed for microprocessors with greater numbers of transistors on each chip than previous models. Unlike ceramic pin grid arrays (CPGA) or tape carrier packages (TCP), PPGA packages offer a greater amount of thermal resistance and improved electrical performance and power distribution, which directly affect the potential performance of microprocessors sensitive to heat transmission.

Intel Packaging Databook  Data reference guide to Intel package selection and availability. An Introduction to Plastic Pin Grid Array Packaging Includes and overview, performance and system level characteristics and a performance comparison with CPGA. Hardware Central Detailed test reports on the latest desktop and laptop computers. Plus news on trend-setting products just coming into the pipeline. PowerLeap PL-Neo S370 Review FC-PGA and PPGA differences are examined and why the two are not interchangeable. PPGA Manufacturing Advantage Tips Practical tips that make it easier for you to use Intel products in the manufacturing environment.